Our Facilities

• Wafer BSG 6″/8″/12″
• Fully Automated Wafer Saw 6″/8″/12″
• Fully Automated High Accuracy Die Attach and Flip Chip Bonding
• Fully Automated High Speed Copper/Gold Ball Bonding
• Fully Automated Aluminum Bonding
• Fully Automated Compression Molding/Encapsulation and Traditional Transfer Mold
• Fully Automated SMD Placement (down to 01005)
• SMD Reflow
• Vacuum SMD Reflow/Sealing
• Solder Electro-Plating (100% Sn and 85/15 Sn/Pb)
• Laser Etch Cutting
• Laser/Ink Marking
• Inspection CSAM
• Inspection XRAY
• Inspection XRF
• Inspection Automated Optical Inspection